Product introduction
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Solder Paste Process Reflow Oven Kd-V10s
HVT solder paste process reflow oven good work for diode and audion with solder paste process, also can work with nitrogen and formic acid gass or other protection gas , and ensure the products soldering with lower void
Technical Parameters
| Name | Vacuum Reflow Oven |
| Model | KD-V10S |
| Max Welding size | Min:150*150mm;Max:410*470mm |
| Ouantity of Preheating zone | Up:8/Down:8 |
| Length of Heating zone | 3800mm |
| Ouantity of Cooling zone | Up:2/Down:2 |
| Vacuum zone | 1 |
| Min vacuum | 10-100pa |
| Vacuum speed | 40m³/h (adjustable) |
| Visual observe window | 1 |
| Flux recovery system | Reduce the number ofequipment maintenance times, extended service life of parts |
| Control system | Siemens PLC |
| Process control | Time ofout vacuum,Vacuum pressure, Out vacuum speed, Vacuum hold time. out gas time all can set by self |
| Width of conveyer net | 450mm |
| Adjust range of transmit track | 50-400mm |
| Transmission direction | L-R |
| Height of Transmission | Netz:880+20MM;Chain 900+20MM |
| Transmission way | Chain transmit |
| Transmission speed | 300-2000mm/min |
| Power | 380V,3-phase five-wire,50/60HZ |
| Start power | 52kw |
| Working power | Approx 10kw |
| Heating time | 20min |
| Temperature control range | Room-350°C |
| Temperature control way | Computer closed loop control,SSR drive |
| Control way ofWhole machine | Siemens PLC |
| Temperature control accuracy | ±1°C |
| PCB board temperature difference | ±3°C |
| Cooling way | Cooling water |
| Alarm | When temperature anomaly |
| 3-Colors light indication | Yellow:Heating Green: Constant temperature Red:Temperature anomaly |
| Needed air exhaust | 10cubic/min 2-tube ф180mm |
| Nitrogen protector | Flow rate of Nitrogen 20-30 cubic/hour,Oxygen concentration 500-800ppm |
| External water-cooling system | Power 3P,Cooling speed >3-6°c/sec |
| Oven size (LxWxH) | 6700*1400*1600 |
| Weight | Approx 2800kg |
Why Choose Us
Audion vacuum soldering system software operate in english ,clear of the layout and process editing consecution, easy to operate for new technicians ;During the working , senior engineer can edit the process ,and can also be written during reverse process ,timely improve process , can shorten the time of process adjust; Also can be based on customer needs to customize.
We also provide on-site service for overseas customers.
By adhering to the principle of honesty and trustworthiness, we maintain the confidentiality of all documents we receive from customers, such as the design plan, the process, and technical information, and only use the relevant documents between us and our customers.
Frequently Asked Questions
In a vacuum reflow oven, power modules are soldered in a controlled environment to prevent oxidation and improve solder joint reliability in power module devices. As these modules often handle high power and generate considerable heat, vacuuming during the reflow process can minimize oxidation and improve solder joint reliability.
