Chenglian Kaida (Hebei) Technology Co., Ltd -About Us

About Us

Chenglian Kaida (Hebei) Technology Co., Ltd was founded in 2007, with a current factory area of 20,000 square meters. It possesses a professional research and development team with a background from the Chinese Academy of Sciences (CAS) and a strong technical service team. Currently, it has established branches, production bases, and offices in Shanghai, Nanjing, Xi'an, Shenzhen, Chengdu, Suzhou, and other places. HVT has been focusing on the design and development of semiconductor device packaging lines for many years, persisting in independent innovation and effectively solving problems such as void rate in soldering and hermetic packaging. It has now established a joint research and development center, along with the IGBT Industry Alliance， CAS Shenyang, Beijing Institute of Technology, Tsinghua Unigroup, Xi'an Jiaotong University, Huazhong University of Science and Technology, Nanjing University, and other universities, dedicated to the research and development of power devices, semiconductor electronic device packaging, and packaging materials.

About Us

As of early 2024, the company has successfully conducted testing for over 2000 clients, spanning industries such as electronics assembly, traditional packaging, and advanced packaging. These tests encompass a wide range of fields includin high—power IGBT devices, automotive electronic components, lasers, radio frequency (RF), microwave, LED epitaxy, device sealing, high-power ceramics, and other specialized areas. The products have garnered consistent praise from semiconductor device packaging plants, academic institutions. The company continues to increase investment in advanced packaging, particularly in wafer-level packaging and nano-silver sintering equipment, to maintain its leading position in this industry.

In response to the development demands of the domestic market, the company has introduced solutions tailored to optimize the entire process of IGBT and automotive power device packaging. It has established comprehensive packaging solutions for diodes and transistors that eliminate the need for cleaning. Furthermore, the company has achieved customized communication module and non-standard automation, offering tailored solutions to domestic semiconductor device packaging clients and providing them with high-quality services.

Development History

2007

Chenglian Kaida (Hebei) Technology Co., Ltd was established (SMT equipment manufacturing)
2012

The integrated circuit packaging and vacuum soldering series products have been launched into the market.
2015

The vacuum series products KD-V20 and V43 are in mass production and available for sale.
2016

The Shenzhen, Shanghai, and Nanjing offices have been established; Offer timely and effective technical service.
2017

Offices in Xi'an and Chengdu have been established. Mass production Multi-layer vacuum reflow oven KD-V3/V5,and Hot-air vacuum reflow oven for paste KD-V8N.V5, V8N, and other large vacuum welding.
2019

Mass production and sales of the fully automatic formic acid vacuum soldering system KD-V300.
2020

Production and sales of IGBT power device packaging production line processes and solutions, as well as fully automatic formic acid vacuum soldering system KD-V300/V400/V400L/V400PRO.
2024

As of March 2024, more than 300 units of fully-automatic formic acid soldering system for IGBT module production have been used in customers site.

Why Chose Us

Based on independently developed software control systems, we offer an IoT system as standard equipment for power module packaging plants. Additionally, our system can be integrated with customer MES systems to develop material delivery processes and product process logic.

We conduct independent research, design, and processing of key core technologies and components( including material selection, flow design, heating technology, and high-vacuum chamber construction).

We possess extensive experience and technical expertise in SMT surface mount technology, semiconductor integrated circuit packaging technology, and high-vacuum soldering processes(Including knowledge in soldering materials, device surface treatment, emperature profiles, vacuum levels, and setting parameters such as formic acid atmosphere）.

The company currently employs nearly 300 staff, with over 30% dedicated to technical research and development. (Including personnel involved in product design, testing, electrical engineering, software development, process engineering, technical engineering, and laboratory work). We have established deep collaborations with military, scientific research institutions, and have accumulated over 50 invention patents.

Our technical service team is available 24/7 to provide high-quality and timely support to our customers. We commit to presenting solutions within 2 hours and aim to be on-site within 12 hours of receiving a request.

We are continuously innovating and steadily upgrading our products, while also increasing investment in the development of new technologies and processes.

Strength Witness