Product introduction
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Inline Vacuum Reflow Oven KD-V400
KD-V400 series solder machine features four separate process chambers, in-line substrate handling, and in-line carrier transfer for highly efficient series production. Continuously soldering preforms and/or pastes is possible with the system. Permanent process monitoring guarantees soldering reproducibility.
Technical Parameters
| Dimensions | Approximately 3950x1960x1900mm |
| Weight | Appro 2900 kg |
| Effective soldering area | KD-V300:（280mm*190mm)*2 ; KD-V400:（280mm*190mm)*2 KD-V400L:（420mm*220mm)*2 ; KD-V400Pro:（274mm*166mm)*3 |
| Furnace height | 80mm |
| Tray heating rate | Up to 4°C/s |
| Tray cooling rate | Up to 3°C/s |
| temperature uniformity | ≤2% |
| Ultimate vacuum | 10Pa |
| Bottom soldering temperature | ≤450°C |
| Power rating | Maximum power: 28 kw, working power: 8-10 kw |
| Heating platform | Made of special treated copper |
| Power supply standards | 380V, 50Hz/60Hz, three-phase five-wire system, 10-square-copper wire |
| Gas supply | Nitrogen system, formic acid system |
| Platform load capacity | 20Kg |
| Application fields | ctronic device assembly, MMIC hybrid circuit packaging, microwave modules, hermetic package sealing for tubes, MEMS devices, high-power, etc. |
| Control Component | Such as air switches, contactors, relays, photoelectric switches, limit switches, motors, etc., use internationally renowned brands |
| Formic acid leakage alarm | |
| Chamber over-temperature alarm and extreme temperature protection | |
| Over-temperature alarm and low-temperature alarm | |
| Self-checking safety light curtain | |
| Dual electric door supports to prevent sudden door drop | |
| Cooling water pressure detection system with low-pressure alarm and software prompt | |
| Air pressure detection system with high and low-pressure alarms and software prompt | |
| Chamber door position detection protection | |
| Isolation of electrical components from water-cooling and air-circuit components | |
| One-button power cutoff for the heating section | |
Features of Reflow Solder Machine
· Void-free solder connections
· Soldering with preforms and/or pastes
· Process temperatures up to 300 °C
· Controlled temperature gradients
· Short cycle times
· Separate soldering and cooling chamber
· Flux-free soldering with formic acid
· Reproducibility of the soldering results
· Traceability
· Permanent process control
· Viewing system
· Independent temperature control system
Frequently Asked Questions
1. What is Reflow Soldering?
Reflow soldering involves applying solder paste to PCB contact pads. It also involves placing the electrical components on it, and melting the solder paste to connect the components.One major difference between reflow soldering and traditional soldering is that heated air is used to melt the solder instead of a soldering iron.In a reflow oven with an infrared lamp, the entire assembly is heated, melting the solder and joining the electrical components.Furthermore, you can regulate the infrared lamp's temperature to prevent thermal shock from breaking the board.By using the reflow soldering technique, thermal shock can be prevented.weakens and breaks joints easily.d break easily.
2.What Are The Advantages Of HVT China Reflow Soldering Machines?
Compared to Pink's VADU 400XL, KD-V400 is a china nitrogen reflow oven for mass production and has been upgraded and optimized.
3.Temperature control advantage: There are nine heating rods on our product's bottom heating plate, each of which has a control system that is independent. This effectively resolves the issue of low platform temperatures at the edges and a significant temperature difference between the edges and the center. As a result, our product provides more uniform heating, ensuring consistent temperature across the platform and improving soldering quality.
4.Flexible workflow: The china reflow soldering machine automatically stops during the working process if any issues arise, so that we can analyze the problem. During a segmented process, operators can choose any segmented process to continue the work if the problem does not affect soldering quality. When the problem is serious, alternative materials can be selected directly. This facilitates workflow efficiency and reliability.
5.Vacuum control advantage: By adjusting the vacuum speed between 0-100%, we address the chip displacement issue during rapid pressure reduction. As a result, vacuum evacuation of molten solder can be controlled more efficiently, reducing the void formation, ensuring better quality and control during the soldering process.
